Heterogeneous Integrations

• Κύριος συγγραφέας: Lau, John H. (Συγγραφέας, http://id.loc.gov/vocabulary/relators/aut)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Singapore : Springer Singapore : Imprint: Springer, 2019.
• Έκδοση: 1st ed. 2019.
• Θέματα: Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Electronic Circuits and Devices.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other...

Πίνακας περιεχομένων:

• Chapter 1. Overview of 3D IC Heterogeneous Integrations
• Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates
• Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers)
• Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges)
• Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates
• Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking
• Chapter 7. 3D IC Heterogeneous Integration in PoP Formats
• Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats
• Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL
• Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.