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oapen-20.500.12657-251932023-06-27T14:02:19Z Nanoparticle Engineering for Chemical-Mechanical Planarization Paik, Ungyu Park, Jea-Gun Material Sciences bic Book Industry Communication::T Technology, engineering, agriculture::TB Technology: general issues::TBN Nanotechnology Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance. 2019-04-26 23:55 2020-03-17 03:00:34 2020-04-01T10:29:58Z 2020-04-01T10:29:58Z 2009 book 1004898 OCN: 1100491609 9781000023220 9780367446062 9781420059113 9780429291890 9781420059137 http://library.oapen.org/handle/20.500.12657/25193 eng application/pdf n/a 1004898.pdf Taylor & Francis CRC Press 10.1201/9780429291890 102698 10.1201/9780429291890 7b3c7b10-5b1e-40b3-860e-c6dd5197f0bb b818ba9d-2dd9-4fd7-a364-7f305aef7ee9 9781000023220 9780367446062 9781420059113 9780429291890 9781420059137 Knowledge Unlatched (KU) CRC Press 102698 KU Select 2018: STEM Backlist Books Knowledge Unlatched open access
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Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.
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