9781439862070.pdf
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
| Γλώσσα: | English |
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Taylor & Francis
2020
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| Διαθέσιμο Online: | https://www.taylorfrancis.com/books/9780429063350 |
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oapen-20.500.12657-41662 |
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oapen-20.500.12657-416622020-09-22T00:42:30Z Semiconductor Packaging Chen, Andrea Lo, Randy Hsiao-Yu Circuits and Devices Electromagnetics and Microwaves Electronic Packaging ENG MATERIALS ElectricalEngineering SCI-TECH STM array ball compound frame grid lead level molding package wafer bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering::TJFC Circuits & components bic Book Industry Communication::T Technology, engineering, agriculture::TG Mechanical engineering & materials::TGM Materials science In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. 2020-09-21T13:34:11Z 2020-09-21T13:34:11Z 2012 book ONIX_20200921_9781439862070_22 https://library.oapen.org/handle/20.500.12657/41662 eng application/pdf n/a 9781439862070.pdf https://www.taylorfrancis.com/books/9780429063350 Taylor & Francis CRC Press 10.1201/b11260 10.1201/b11260 7b3c7b10-5b1e-40b3-860e-c6dd5197f0bb CRC Press 216 open access |
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OAPEN |
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| language |
English |
| description |
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. |
| title |
9781439862070.pdf |
| spellingShingle |
9781439862070.pdf |
| title_short |
9781439862070.pdf |
| title_full |
9781439862070.pdf |
| title_fullStr |
9781439862070.pdf |
| title_full_unstemmed |
9781439862070.pdf |
| title_sort |
9781439862070.pdf |
| publisher |
Taylor & Francis |
| publishDate |
2020 |
| url |
https://www.taylorfrancis.com/books/9780429063350 |
| _version_ |
1771297620958904320 |
