entwicklung-keramischer-vergussmassen-mit-alkoxysilanen-zur-steigerung-der-haftfestigkeit.pdf
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
| Γλώσσα: | ger |
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| Έκδοση: |
KIT Scientific Publishing
2023
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| Διαθέσιμο Online: | https://doi.org/10.5445/KSP/1000156532 |
| Περίληψη: | The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load. |
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