entwicklung-keramischer-vergussmassen-mit-alkoxysilanen-zur-steigerung-der-haftfestigkeit.pdf

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Λεπτομέρειες βιβλιογραφικής εγγραφής
Γλώσσα:ger
Έκδοση: KIT Scientific Publishing 2023
Διαθέσιμο Online:https://doi.org/10.5445/KSP/1000156532