entwicklung-keramischer-vergussmassen-mit-alkoxysilanen-zur-steigerung-der-haftfestigkeit.pdf
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...
| Language: | ger |
|---|---|
| Published: |
KIT Scientific Publishing
2023
|
| Online Access: | https://doi.org/10.5445/KSP/1000156532 |
