entwicklung-keramischer-vergussmassen-mit-alkoxysilanen-zur-steigerung-der-haftfestigkeit.pdf

• Language: ger
• Published: KIT Scientific Publishing 2023

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...