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03427nam a2200685 4500 |
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ocn705354458 |
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20170124071921.6 |
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110304s2010 nju ob 001 0 eng d |
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|a DG1
|b eng
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|c DG1
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|d IEEEE
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|a 708569123
|a 747427264
|a 776996241
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|a 9780470901199
|q (electronic bk.)
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|a 0470901195
|q (electronic bk.)
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|a 9781118102749
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|a 1118102746
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|a 9781613444238
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|a 1613444230
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|z 9780470410745
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|z 0470410744
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|a (OCoLC)705354458
|z (OCoLC)708569123
|z (OCoLC)747427264
|z (OCoLC)776996241
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|a 10.1002/9780470901199
|b Wiley InterScience
|n http://www3.interscience.wiley.com
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|a 9780470901199
|b IEEE
|n http://ieeexplore.ieee.org
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|a TK7836
|b .B38 2010
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|a HOM
|x 015000
|2 bisacsh
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|a 621.9/77
|2 22
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|a MAIN
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|a Bath, Jasbir.
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|a Lead-free solder process development /
|c Jasbir Bath, Greg Henshall, Carol Handwerker.
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|a Hoboken, N.J. :
|b Wiley,
|c [2010]
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|c ©2010
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|a 1 online resource (284 pages)
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Front Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index.
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|a Includes bibliographical references and index.
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|a Print version record.
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|a Lead-free electronics manufacturing processes.
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|a Solder and soldering.
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|a HOUSE & HOME
|x Power Tools.
|2 bisacsh
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|a Lead-free electronics manufacturing processes.
|2 fast
|0 (OCoLC)fst01202123
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|a Solder and soldering.
|2 fast
|0 (OCoLC)fst01125221
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|a Electronic books.
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|a Henshall, Gregory Arthur.
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1 |
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|a Handwerker, Carol A.
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0 |
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|i Print version:
|t Lead-free solder process development.
|d Hoboken, N.J. : Wiley, ©2011
|z 9780470410745
|w (DLC) 2010028407
|w (OCoLC)419865761
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856 |
4 |
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|u https://doi.org/10.1002/9780470901199
|z Full Text via HEAL-Link
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|a 92
|b DG1
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