Structural dynamics of electronic and photonic systems /
"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable...
| Συγγραφή απο Οργανισμό/Αρχή: | |
|---|---|
| Άλλοι συγγραφείς: | , , |
| Μορφή: | Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Hoboken, N.J. :
Wiley,
2010.
|
| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Frontmatter
- Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems / David S Steinberg
- Linear Response to Shocks and Vibrations / Ephraim Suhir
- Linear and Nonlinear Vibrations Caused by Periodic Impulses / Ephraim Suhir
- Random Vibrations of Structural Elements in Electronic and Photonic Systems / Ephraim Suhir
- Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations / David S Steinberg
- Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling / T X Yu, C Y Zhou
- Shock Test Methods and Test Standards for Portable Electronic Devices / C Y Zhou, T X Yu, S W Ricky Lee, Ephraim Suhir
- Dynamic Response of Solder Joint Interconnections to Vibration and Shock / David S Steinberg
- Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment / David S Steinberg
- Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy / Fubin Song, S W Ricky Lee, Keith Newman, Bob Sykes, Stephen Clark
- Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging / V B C Tan, K C Ong, C T Lim, J E Field
- Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration / T E Wong
- Vibration Considerations for Sensitive Research and Production Facilities / E E Ungar, H Amick, J A Zapfe
- Applications of Finite Element Analysis: Attributes and Challenges / Metin Ozen
- Shock Simulation of Drop Test of Hard Disk Drives / D W Shu, B J Shi, J Luo
- Shock Protection of Portable Electronic Devices Using a ₃Cushion₄ of an Array of Wires (AOW) / Ephraim Suhir
- Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads / Toni T Matilla, Pekka Marjamaki, Jorma Kivilahti
- Dynamic Response of PCB Structures to Shock Loading in Reliability Tests / Milena Vujosevic, Ephraim Suhir
- Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? / Ephraim Suhir
- Shock Isolation of Micromachined Device for High- Applications / Sang-Hee Yoon, Jin-Eep Roh, Ki Lyug Kim
- Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods / X Q Shi, G Y Li, Q J Yang
- Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies / Reza Ghaffarian
- Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? / Ephraim Suhir, Luciano Arruda
- Index.
