LED packaging for lighting applications : design, manufacturing, and testing /

LED packaging for lighting applications : design, manufacturing, and testing /

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Liu, S. (Sheng), 1963-
Άλλοι συγγραφείς: Luo, Xiaobing, 1974-
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, N.J. : Wiley, 2011.
Θέματα:
Light emitting diodes > Design and construction.
Light emitting diodes > Computer simulation.
Electronic packaging.
Electric lighting > Equipment and supplies.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
TECHNOLOGY & ENGINEERING > Electronics > Semiconductors.
TECHNOLOGY & ENGINEERING > Electronics > Solid State.
Electronic books.
Διαθέσιμο Online:Full Text via HEAL-Link
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020 |z 9781118082959  |q (Mobi) 
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029 1 |a AU@  |b 000053280325 
029 1 |a DEBSZ  |b 37273457X 
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037 |a 10.1002/9780470827857  |b Wiley InterScience  |n http://www3.interscience.wiley.com 
050 4 |a TK7871.89.L53  |b L58 2011 
072 7 |a TEC  |x 008090  |2 bisacsh 
072 7 |a TEC  |x 008100  |2 bisacsh 
082 0 4 |a 621.3815/22  |2 23 
049 |a MAIN 
100 1 |a Liu, S.  |q (Sheng),  |d 1963- 
245 1 0 |a LED packaging for lighting applications :  |b design, manufacturing, and testing /  |c Sheng Liu, Xiaobing Luo. 
264 1 |a Hoboken, N.J. :  |b Wiley,  |c 2011. 
300 |a 1 online resource (xxi, 352 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
505 0 |a Front Matter -- Introduction -- Fundamentals and Development Trends of High Power LED Packaging -- Optical Design of High Power LED Packaging Module -- Thermal Management of High Power LED Packaging Module -- Reliability Engineering of High Power LED Packaging -- Design of LED Packaging Applications -- LED Measurement and Standards -- Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance -- Index. 
520 |a "This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--  |c Provided by publisher. 
504 |a Includes bibliographical references and index. 
650 0 |a Light emitting diodes  |x Design and construction. 
650 0 |a Light emitting diodes  |x Computer simulation. 
650 0 |a Electronic packaging. 
650 0 |a Electric lighting  |x Equipment and supplies. 
650 4 |a Electric lighting  |x Equipment and supplies. 
650 4 |a Electronic packaging. 
650 4 |a Light emitting diodes  |x Computer simulation. 
650 4 |a Light emitting diodes  |x Design and construction. 
650 4 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Circuits  |x General. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Circuits  |x General.  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Semiconductors.  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Solid State.  |2 bisacsh 
655 4 |a Electronic books. 
655 0 |a Electronic books. 
700 1 |a Luo, Xiaobing,  |d 1974- 
776 0 8 |i Print version:  |a Liu, S. (Sheng), 1963-  |t LED packaging for lighting applications.  |d Hoboken, N.J. : Wiley, 2011  |z 9780470827833  |w (DLC) 2011015480  |w (OCoLC)690090005 
856 4 0 |u https://doi.org/10.1002/9780470827857  |z Full Text via HEAL-Link 
994 |a 92  |b DG1 

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