LED packaging for lighting applications : design, manufacturing, and testing /

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Liu, S. (Sheng), 1963-
Άλλοι συγγραφείς: Luo, Xiaobing, 1974-
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, N.J. : Wiley, 2011.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Front Matter
  • Introduction
  • Fundamentals and Development Trends of High Power LED Packaging
  • Optical Design of High Power LED Packaging Module
  • Thermal Management of High Power LED Packaging Module
  • Reliability Engineering of High Power LED Packaging
  • Design of LED Packaging Applications
  • LED Measurement and Standards
  • Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance
  • Index.