LED packaging for lighting applications : design, manufacturing, and testing /

• Main Author: Liu, S. (Sheng), 1963-
• Other Authors: Luo, Xiaobing, 1974-
• Format: eBook
• Language: English
• Published: Hoboken, N.J. : Wiley, 2011.
• Subjects: Light emitting diodes > Design and construction.; Light emitting diodes > Computer simulation.; Electronic packaging.; Electric lighting > Equipment and supplies.; TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.; TECHNOLOGY & ENGINEERING > Electronics > Semiconductors.; TECHNOLOGY & ENGINEERING > Electronics > Solid State.; Electronic books.

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Table of Contents:

• Front Matter
• Introduction
• Fundamentals and Development Trends of High Power LED Packaging
• Optical Design of High Power LED Packaging Module
• Thermal Management of High Power LED Packaging Module
• Reliability Engineering of High Power LED Packaging
• Design of LED Packaging Applications
• LED Measurement and Standards
• Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance
• Index.