Advanced interconnects for ULSI technology /

Advanced interconnects for ULSI technology /

"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς: Baklanov, Mikhail, Ho, P. S., Zschech, Ehrenfried
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, NJ : Wiley, 2012.
Θέματα:
Interconnects (Integrated circuit technology)
Integrated circuits > Ultra large scale integration.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > VLSI & ULSI.
COMPUTERS > Logic Design.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Logic.
Electronic books.
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Front Matter
  • Colour Plates
  • Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen
  • Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov
  • Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov
  • Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov
  • Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin
  • Diffusion Barriers / Michael Hecker, Rene Hubner
  • Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao
  • Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee
  • Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho
  • Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak
  • Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel
  • Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech
  • Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano
  • Optical Interconnects / Wim Bogaerts
  • Wireless Interchip Interconnects / Takamaro Kikkawa
  • Index.

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