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04821nam a2200757 4500 |
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ocn779616373 |
| 003 |
OCoLC |
| 005 |
20170124071641.3 |
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m o d |
| 007 |
cr cn||||||||| |
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120309s2012 gw a obf 001 0 eng d |
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|a DG1
|b eng
|e pn
|c DG1
|d E7B
|d YDXCP
|d GZM
|d OCLCO
|d DEBSZ
|d OCLCQ
|d N$T
|d OCLCF
|d OCLCQ
|d CDX
|d COO
|d OCL
|d OCLCQ
|d AZK
|d DG1
|d GrThAP
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| 019 |
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|a 785777901
|a 794707297
|a 961632813
|a 962650779
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|a 9783527644247
|q (electronic bk.)
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|q (electronic bk.)
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|z 3527644245
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|z 9783527644223
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|b 820120-katalog:000600708
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|a NZ1
|b 14696616
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| 029 |
1 |
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|a NZ1
|b 15340966
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| 035 |
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|a (OCoLC)779616373
|z (OCoLC)785777901
|z (OCoLC)794707297
|z (OCoLC)961632813
|z (OCoLC)962650779
|
| 037 |
|
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|a 10.1002/9783527644223
|b Wiley InterScience
|n http://www3.interscience.wiley.com
|
| 050 |
|
4 |
|a QC611.6.S9
|b H36 2012
|
| 072 |
|
7 |
|a TEC
|x 008090
|2 bisacsh
|
| 072 |
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7 |
|a TEC
|x 008100
|2 bisacsh
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| 082 |
0 |
4 |
|a 621.38152
|2 22
|
| 049 |
|
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|a MAIN
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| 245 |
0 |
0 |
|a Handbook of wafer bonding /
|c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
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| 264 |
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1 |
|a Weinheim :
|b Wiley-VCH,
|c [2012]
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| 264 |
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4 |
|c ©2012
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| 300 |
|
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|a 1 online resource (xxxi, 395 pages) :
|b illustrations (some color)
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| 336 |
|
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|a text
|b txt
|2 rdacontent
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| 337 |
|
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
|
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|a data file
|2 rda
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| 380 |
|
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|a Bibliography
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| 380 |
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|a Handbook
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| 505 |
0 |
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|a Front Matter -- Technologies. Glass Frit Wafer Bonding / Roy Knechtel -- Wafer Bonding Using Spin-On Glass as Bonding Material / Viorel Dragoi -- Polymer Adhesive Wafer Bonding / Frank Niklaus, Jian-Qiang Lu -- Anodic Bonding / Adriana Cozma Lapadatu, Kari Schj̜lberg-Henriksen -- Direct Wafer Bonding / Manfred Reiche, Ulrich G̲sele -- Plasma-Activated Bonding / Maik Wiemer, Dirk Wuensch, Joerg Braeuer, Thomas Gessner -- Au/Sn Solder / Hermann Oppermann, Matthias Hutter -- Eutectic Au?In Bonding / Mitsumasa Koyanagi, Makoto Motoyoshi -- Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers / Kuan-Neng Chen, Chuan Seng Tan -- Wafer-Level Solid₆Liquid Interdiffusion Bonding / Nils Hoivik, Knut Aasmundtveit -- Hybrid Metal/Polymer Wafer Bonding Platform / Jian-Qiang Lu, J Jay McMahon, Ronald J Gutmann -- Cu/SiO Hybrid Bonding / Ľa Di Cioccio -- Metal/Silicon Oxide Hybrid Bonding / Paul Enquist -- Applications. Microelectromechanical Systems / Maaike M V Taklo -- Three-Dimensional Integration / Philip Garrou, James Jian-Qiang Lu, Peter Ramm -- Temporary Bonding for Enabling Three-Dimensional Integration and Packaging / Rama Puligadda -- Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems / Armin Klumpp, Peter Ramm -- Thin Wafer Support System for above 250ʻC Processing and Cold De-Bonding / Werner Pamler, Franz Richter -- Temporary Bonding: Electrostatic / Christof Landesberger, Armin Klumpp, Karlheinz Bock -- Index.
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| 500 |
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|a Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
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| 504 |
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|a Includes bibliographical references and index.
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| 588 |
0 |
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|a Print version record.
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| 650 |
|
0 |
|a Semiconductor wafers
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Semiconductors
|x Bonding
|v Handbooks, manuals, etc.
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| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Semiconductors.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Solid State.
|2 bisacsh
|
| 650 |
|
7 |
|a Semiconductor wafers.
|2 fast
|0 (OCoLC)fst01112189
|
| 650 |
|
7 |
|a Semiconductors
|x Bonding.
|2 fast
|0 (OCoLC)fst01112201
|
| 655 |
|
4 |
|a Electronic books.
|
| 655 |
|
7 |
|a Handbooks and manuals.
|2 fast
|0 (OCoLC)fst01423877
|
| 700 |
1 |
|
|a Ramm, Peter.
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| 700 |
1 |
|
|a Lu, James Jian-Qiang.
|
| 700 |
1 |
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|a Taklo, Maaike M. V.
|
| 776 |
0 |
8 |
|i Print version:
|t Handbook of wafer bonding.
|d Weinheim : Wiley-VCH, ©2012
|z 9783527326464
|w (OCoLC)781684626
|
| 856 |
4 |
0 |
|u https://doi.org/10.1002/9783527644223
|z Full Text via HEAL-Link
|
| 994 |
|
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|a 92
|b DG1
|
