Handbook of wafer bonding /

• Άλλοι συγγραφείς: Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.
• Μορφή: Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Weinheim : Wiley-VCH, [2012]
• Θέματα: Semiconductor wafers > Handbooks, manuals, etc.; Semiconductors > Bonding > Handbooks, manuals, etc.; TECHNOLOGY & ENGINEERING > Electronics > Semiconductors.; TECHNOLOGY & ENGINEERING > Electronics > Solid State.; Semiconductor wafers.; Semiconductors > Bonding.; Electronic books.; Handbooks and manuals.

Πίνακας περιεχομένων:

• Front Matter
• Technologies. Glass Frit Wafer Bonding / Roy Knechtel
• Wafer Bonding Using Spin-On Glass as Bonding Material / Viorel Dragoi
• Polymer Adhesive Wafer Bonding / Frank Niklaus, Jian-Qiang Lu
• Anodic Bonding / Adriana Cozma Lapadatu, Kari Schj̜lberg-Henriksen
• Direct Wafer Bonding / Manfred Reiche, Ulrich G̲sele
• Plasma-Activated Bonding / Maik Wiemer, Dirk Wuensch, Joerg Braeuer, Thomas Gessner
• Au/Sn Solder / Hermann Oppermann, Matthias Hutter
• Eutectic Au?In Bonding / Mitsumasa Koyanagi, Makoto Motoyoshi
• Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers / Kuan-Neng Chen, Chuan Seng Tan
• Wafer-Level Solid₆Liquid Interdiffusion Bonding / Nils Hoivik, Knut Aasmundtveit
• Hybrid Metal/Polymer Wafer Bonding Platform / Jian-Qiang Lu, J Jay McMahon, Ronald J Gutmann
• Cu/SiO Hybrid Bonding / Ľa Di Cioccio
• Metal/Silicon Oxide Hybrid Bonding / Paul Enquist
• Applications. Microelectromechanical Systems / Maaike M V Taklo
• Three-Dimensional Integration / Philip Garrou, James Jian-Qiang Lu, Peter Ramm
• Temporary Bonding for Enabling Three-Dimensional Integration and Packaging / Rama Puligadda
• Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems / Armin Klumpp, Peter Ramm
• Thin Wafer Support System for above 250ʻC Processing and Cold De-Bonding / Werner Pamler, Franz Richter
• Temporary Bonding: Electrostatic / Christof Landesberger, Armin Klumpp, Karlheinz Bock
• Index.