Lead-free solders : materials reliability for electronics /
| Κύριος συγγραφέας: | |
|---|---|
| Συγγραφή απο Οργανισμό/Αρχή: | |
| Μορφή: | Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Hoboken, NJ :
John Wiley & Sons,
2012.
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Front Matter
- Thematic Area I: Introduction. Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters / K N Subramanian
- Thematic Area II: Phase Diagrams and Alloying Concepts. Phase Diagrams and Their Applications in Pb-Free Soldering / Sinn-Wen Chen, Wojciech Gierlotka, Hsin-Jay Wu, Shih-Kang Lin
- Phase Diagrams and Alloy Development / Alan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova, Pavel Broz
- Interaction of Sn-Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry / Clemens Schmetterer, Rajesh Ganesan, Herbert Ipser
- Thematic Area III: Microalloying to Improve Reliability. ₁Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints₂ / Sung K Kang
- Development and Characterization of Nano-Composite Solder / Johan Liu, Si Chen, Lilei Ye
- Thematic Area IV: Chemical Issues Affecting Reliability. Chemical Changes for Lead-Free Soldering and Their Effect on Reliability / Laura J Turbini
- Thematic Area V: Mechanical Issues Affecting Reliability. Influence of Microstructure on Creep and High Strain Rate Fracture of Sn-Ag-Based Solder Joints / P Kumar, Z Huang, I Dutta, G Subbarayan, R Mahajan
- Microstructure and Thermomechanical Behavior Pb-Free Solders / D R Frear
- Electromechanical Coupling in Sn-Rich Solder Interconnects / Q S Zhu, H Y Liu, L Zhang, Q L Zeng, Z G Wang, J K Shang
- Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn-Ag Solder Joints / Andre Lee, Deep Choudhuri, K N Subramanian
- Thematic Area VI: Whisker Growth Issues Affecting Reliability. Sn Whiskers: Causes, Mechanisms and Mitigation Strategies / Nitin Jadhav, Eric Chason
- Tin Whiskers / Katsuaki Suganuma
- Thematic Area VII: Electromigration Issues Affecting Reliability. Electromigration Reliability of Pb-Free Solder Joints / Seung-Hyun Chae, Yiwei Wang, Paul S Ho
- Electromigration in Pb-Free Solder Joints in Electronic Packaging / Chih Chen, Shih-Wei Liang, Yuan-Wei Chang, Hsiang-Yao Hsiao, Jung Kyu Han, K N Tu
- Effects of Electromigration on Electronic Solder Joints / Sinn-Wen Chen, Chih-Ming Chen, Chao-Hong Wang, Chia-Ming Hsu
- Thematic Area VIII: Thermomigration Issues Affecting Reliability. Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints / Tian Tian, K N Tu, Hsiao-Yun Chen, Hsiang-Yao Hsiao, Chih Chen
- Thematic Area IX: Miniaturization Issues Affecting Reliability. Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects / Golta Khatibi, Herbert Ipser, Martin Lederer, Brigitte Weiss
- Index.
