Strategies to the prediction, mitigation and management of product obsolescence /
Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better...
| Κύριοι συγγραφείς: | , , , |
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| Μορφή: | Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Hoboken, New Jersey :
Wiley,
[2012]
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| Σειρά: | Wiley series in systems engineering and management.
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Strategies to the Prediction, Mitigation and Management of Product Obsolescence; Contents; Preface; 1: Introduction to Obsolescence Problems; 1.1: Definition of Obsolescence; 1.2: Categorization of Obsolescence Types; 1.3: Definition of Obsolescence Management; 1.4: Categorization of Obsolescence Management Approaches; 1.5: Historical Perspective on Obsolescence; 1.6: Occurrence of Obsolescence; 1.6.1: Technological Evolution; 1.6.2: Technological Revolutions; 1.6.3: Market Forces; 1.6.4: Environmental Policies and Restrictions; 1.6.5: Allocation; 1.6.6: Planned Obsolescence.
- 1.7: Product Sectors Affected by Obsolescence Problems; 1.8: Parts Affected by Obsolescence Problems; 1.8.1: Electronic Part Obsolescence; 1.8.2: Software Obsolescence; 1.8.3: Textile and Mechanical Part Obsolescence; 2: Part Change and Discontinuation Management; 2.1: The Change Process; 2.2: Change-Control Policies of Major Part Manufacturers; 2.3: Change-Notification Policies of Major Companies; 2.3.1: Differences by Manufacturer; 2.3.2: Differences by Division or Manufacturing Location; 2.3.3: Differences by Customer Type; 2.3.4: Differences by Geographical Location; 2.3.5: Distributors.
- 2.3.6: Contract Manufacturers; 2.4: Change-Notification; 2.4.1: Industry Standard Process Change-Notification; 2.4.1.1: Electronic Industries Alliance; 2.4.1.2: U.S. Military; 2.5: Change-Notification Paths; 2.5.1: Direct to Equipment Manufacturers; 2.5.2: Via Distributors; 2.5.3: Via Contract Manufacturers; 2.5.4: Via Independent Services; 2.6: Examples of Common Changes; 2.6.1: Fabrication Changes; 2.6.2: Die Revisions; 2.6.3: Changes to Assembly/Test Locations; 2.6.4: Changes to Assembly Materials; 2.6.5: Packing, Marking, and Shipping Changes.
- 3: Introduction to Electronic Part Product Life Cycles; 3.1: Product Life Cycle Stages; 3.1.1: Introduction Stage; 3.1.2: Growth Stage; 3.1.3: Maturity Stage; 3.1.4: Decline Stage; 3.1.5: Phase-Out Stage; 3.1.6: Discontinuance and Obsolescence; 3.2: Special Cases of the Product Life Cycle Curve; 3.3: Product Life Cycle Stages as a Basis for Forecasting; 4: Obsolescence Forecasting Methodologies; 4.1: Obsolescence Forecasting--Parts with Evolutionary Parametric Drivers; 4.1.1: Basic Life Cycle Curve Forecasting Method; 4.1.1.1: Step 1: Identify Part/Technology Group.
- 4.1.1.2: Step 2: Identify the Part's Primary and Secondary Attributes; 4.1.1.3: Step 3: Obtain Sales Data Associated with the Primary Attribute; 4.1.1.4: Step 4: Construct the Life Cycle Curve and Determine Parameters; 4.1.1.5: Step 5: Determine the Zone of Obsolescence; 4.1.1.6: Step 6: Modify the Zone of Obsolescence; 4.1.1.7: Summary; 4.1.2: Advanced Life Cycle Curve Method; 4.1.2.1: Determining the Window of Obsolescence via Data Mining; 4.1.2.2: Application of Data Mining Determined Windows of Obsolescence to Memory Modules.
- 4.2: Obsolescence Forecasting--Parts without Evolutionary Parametric Drivers.
