Παραπομπή σε μορφή APA (7η εκδ.)

Li, E. (2012). Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging, signal integrity, power integrity and EMC. IEEE Press. https://doi.org/10.1002/9781118166727

Παραπομπή σε μορφή Chicago (17η εκδ.)

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. [United States]: IEEE Press, 2012. https://doi.org/10.1002/9781118166727.

Παραπομπή σε μορφή MLA (8th εκδ.)

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. IEEE Press, 2012. https://doi.org/10.1002/9781118166727.