Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC /

• Κύριος συγγραφέας: Li, Er-Ping
• Μορφή: Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: [United States] : IEEE Press ; [2012]; Hoboken : Wiley, [2012]
• Θέματα: Three-dimensional integrated circuits.; Electrical modeling.; Electronics > Mathematical models.; Electrical engineering.; Physics.; Science.; Engineering.; TECHNOLOGY & ENGINEERING > Electrical.; Electronic books.

"The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a...

Πίνακας περιεχομένων:

• Macromodeling of Complex Interconnects in 3D Integration
• 2.5D Simulation Method for 3D Integrated Systems
• Hybrid Integral Equation Modeling Methods for 3D Integration
• Systematic Microwave Network Analysis for 3D Integrated Systems
• Modeling of Through-Silicon Vias (TSV) in 3D Integration.