Silicon-based millimeter-wave technology measurement, modeling and applications /

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at hig...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς: Cremer, Jay Theodore, Jr
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Amsterdam : Elsevier/Academic Press, 2012.
Σειρά:Advances in imaging and electron physics ; v. 174.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Front Cover; Editor-in-Chief; Silicon-Based Millimeter-wave Technology; Copyright; Contents; Preface; Future Contributions; Foreword; Contributors; Acknowledgements; Permission Acknowledgments; Chapter1
  • Measurement Techniques and Issues; 1. INTRODUCTION; 2. OVERVIEW OF MEASUREMENT METHODS AND INSTRUMENTATION; 3. TRANSMISSION LINE AND S-PARAMETERS; 4. MILLIMETER-WAVE NETWORK ANALYZERS; 5. CASCADING OF S-PARAMETERS AND TRANSMISSION/TRANSFER T-PARAMETERS; 6. CALIBRATION AND DE-EMBEDDING AT MM-WAVES; REFERENCES; Chapter2
  • Transmission Lines and Passive Components; 1. INTRODUCTION.
  • 2. SILICON INTEGRATED CIRCUITS AND TECHNOLOGY3. TRANSMISSION LINES; 4. ELECTROMAGNETICS OF TRANSMISSION LINES AND THEIR DISCONTINUITIES; 5. TRANSITIONS; 6. CAPACITORS, INDUCTORS, AND RESISTORS; 7. RESONATORS AND FILTERS FOR SILICON INTEGRATIONS OF INCREASED FREQUENCIES; 8. POWER DIVIDERS AND DIRECTIONAL COUPLERS FOR SI-INTEGRATED CIRCUITS; 9. PACKAGING OF MILLIMETER-WAVE COMPONENTS AND CHIPS; 10. CONCLUSIONS; REFERENCES; Chapter3
  • Modeling and Design of High-Frequency Structures Using Artificial Neural Networks and Space Mapping; 1. INTRODUCTION TO ARTIFICIAL NEURAL NETWORKS.
  • 2. STRUCTURE OF ARTIFICIAL NEURAL NETWORKS3. ACTIVATION FUNCTIONS; 4. ASPECTS OF ARTIFICIAL NEURAL NETWORK TRAINING; 5. APPLICATIONS OF ARTIFICIAL NEURAL NETWORKS TO MODELING OF ON-CHIP HIGH-FREQUENCY DEVICES; 6. INTRODUCTION TO SPACE MAPPING; 7. THE SPACE MAPPING CONCEPT; 8. THE PARAMETER EXTRACTION STEP; 9. SPACE MAPPING APPROACHES; 10. SPACE MAPPING OPTIMIZATION AND MODELING; 11. APPLICATIONS OF SPACE MAPPING; 12. CONCLUSIONS; REFERENCES; Chapter4
  • Nanoscale FETs; 1. TYPES AND PERFORMANCES OF NANOSCALE MOSFETS; 2. SMALL-SIGNAL ANALYSIS OF MOSFETS AT HIGH FREQUENCIES.
  • 3. HF NOISE MODELING OF MULTIPLE-GATE SOI AND LATERALLY ASYMMETRIC CHANNEL MOS DEVICES4. CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; Chapter5
  • RF MEMS Devices for Communication Systems; 1. INTRODUCTION; 2. GENERAL DESIGN CONSIDERATIONS; 3. MEMS REDUNDANCY SWITCH MATRICES; 4. RF MEMS CROSSBAR SWITCH MATRICES; 5. RF MEMS SWITCH MATRICES WITH PAIRWISE CONNECTION; 6. SWITCH MATRICES FOR HIGH-POWER APPLICATIONS; 7. TUNABLE RF MEMS COMPONENTS; 8. DISCUSSION; REFERENCES; Chapter6
  • Substrate-Integrated Antennas on Silicon; 1. INTRODUCTION; 2. SOME ANTENNA FUNDAMENTALS.
  • 3. FABRICATION OF ANTENNAS ON SILICON SUBSTRATES4. TYPES OF SILICON-BASED INTEGRATED ANTENNAS; 5. INTEGRATED ANTENNA MEASUREMENTS; 6. CROSSTALK AND CIRCUIT NOISE; 7. EFFECT OF SILICON SUBSTRATE RESISTIVITY ON ANTENNA TRANSMISSION GAIN; 8. APPLICATIONS IN WIRELESS PERSONAL AREA NETWORKS (WPANS); 9. SINGLE-CHIP RADIO; 10. PHOTONICALLY RECONFIGURABLE ANTENNAS; 11. CARBON NANOTUBE (CNT) ANTENNAS; 12. VEHICULAR APPLICATIONS; REFERENCES; Color Plates; Volume 151; Volume 152; Volume 153; Volume 154; Volume 155; Volume 156; Volume 157; Volume 158; Volume 159; Volume 160; Volume 161; Volume 162; Volume 163.