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05649nam a2200769 4500 |
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ocn885378211 |
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OCoLC |
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20170124071552.1 |
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m o d |
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cr ||||||||||| |
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140805s2014 nju ob 001 0 eng |
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|a 2014031115
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|a DLC
|b eng
|e rda
|c DLC
|d EBLCP
|d N$T
|d YDXCP
|d DG1
|d E7B
|d VRC
|d OCLCF
|d RECBK
|d OCLCO
|d DEBSZ
|d COO
|d OCLCO
|d DEBBG
|d GrThAP
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|a 961660673
|a 962720608
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|a 9781118831342 (epub)
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|a 1118831349 (epub)
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|a 9781118831359 (pdf)
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|a 1118831357 (pdf)
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|z 9781118831335 (cloth : alk. paper)
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|a 9781118831373
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|a 1118831373
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|a 1118831330
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|a 9781118831335
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|b 000053548397
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|a DEBBG
|b BV043397022
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|a (OCoLC)885378211
|z (OCoLC)961660673
|z (OCoLC)962720608
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|a pcc
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|a TK7870.15
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|a TEC
|x 009070
|2 bisacsh
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|a 621.381/046
|2 23
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| 049 |
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|a MAIN
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0 |
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|a Adhesion in microelectronics /
|c edited by K.L. Mittal and Tanweer Ahsan.
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1 |
|a Hoboken, New Jersey :
|b John Wiley and Sons, Inc.,
|c [2014]
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| 300 |
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|a 1 online resource.
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| 336 |
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|a text
|2 rdacontent
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| 337 |
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|a computer
|2 rdamedia
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| 338 |
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|a online resource
|2 rdacarrier
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| 490 |
1 |
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|a Adhesion and Adhesives: Fundamental and Applied Aspects
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| 504 |
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|a Includes bibliographical references and index.
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| 588 |
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|a Description based on print version record and CIP data provided by publisher.
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|a In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
|c Edited summary from book.
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0 |
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|a Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; Chapter 1: Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; Chapter 2: Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.; 2.1. Introduction; 2.2 Mechanical Methods; 2.3 Laser Based Techniques; 2.4 Summary and Remarks; References
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| 505 |
8 |
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|a Part 2: Ways to Promote/Enhance AdhesionChapter 3: Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.6 Reactions and Bond Formation at the Interface; 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces
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|a 3.8 Summary and ConclusionsAcknowledgement; References; Chapter 4: Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging; 4.1 Introduction; 4.2 Plasma Fundamentals; 4.3 Survey of Vacuum Plasma Treatment of Polymers; 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers; 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics; 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging; References
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8 |
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|a Chapter 5: Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications5.1 Introduction; 5.2 ICA Technology; 5.3 Technology Reviews; 5.4 Electrical Properties; 5.5 Mechanical Properties; 5.6 Thermal Properties; 5.7 Metallic Filler; 5.8 Polymer Materials; 5.9 Reliability; 5.10 Dispensation; 5.11 Environmental Properties; 5.12 Other Results; 5.13 Summary; 5.14 Prospects; References; Part 3: Reliability and Failure Mechanisms; Chapter 6: Role of Adhesion Phenomenon in the Reliability of Electronic Packaging; 6.1 Introduction; 6.2 Hierarchy of Electronic Packaging
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8 |
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|a 6.3 Substrates, Carriers, and Laminates6.4 Flexible Laminates; 6.5 First Level Packaging /Semiconductor Packaging; 6.6 Second Level Packaging; 6.7 Reliability Enhancements; 6.8 Thermal Management; 6.9 Summary; Acknowledgements; References; Chapter 7: Delamination and Reliability Issues in Packaged Devices; 7.1 Introduction; 7.2 Basic Aspects of Delamination Failure; 7.3 Evaluation of Delamination Initiation in Electronic Packages; 7.4 Evaluation of Delamination Propagation in Electronic Packages; 7.5 Summary; References
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| 650 |
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0 |
|a Microelectronic packaging
|x Materials.
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| 650 |
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0 |
|a Adhesives.
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| 650 |
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0 |
|a Adhesive joints.
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| 650 |
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7 |
|a TECHNOLOGY & ENGINEERING / Mechanical
|2 bisacsh
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| 650 |
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7 |
|a Adhesive joints.
|2 fast
|0 (OCoLC)fst00796605
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| 650 |
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7 |
|a Adhesives.
|2 fast
|0 (OCoLC)fst00796614
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| 650 |
|
7 |
|a Microelectronic packaging
|x Materials.
|2 fast
|0 (OCoLC)fst01019754
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| 655 |
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4 |
|a Electronic books.
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| 655 |
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0 |
|a Electronic books.
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| 700 |
1 |
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|a Mittal, K. L.,
|d 1945-
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| 700 |
1 |
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|a Ahsan, Tanweer.
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| 776 |
0 |
8 |
|i Print version:
|t Adhesion in microelectronics
|d Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
|z 9781118831335
|w (DLC) 2014029765
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| 830 |
|
0 |
|a Adhesion and adhesives.
|p Fundamental and applied aspects.
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| 856 |
4 |
0 |
|u https://doi.org/10.1002/9781118831373
|z Full Text via HEAL-Link
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| 994 |
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|a 92
|b DG1
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