Adhesion in microelectronics /

• Other Authors: Mittal, K. L., 1945-, Ahsan, Tanweer
• Format: eBook
• Language: English
• Published: Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
• Series: Adhesion and adhesives. Fundamental and applied aspects.
• Subjects: Microelectronic packaging > Materials.; Adhesives.; Adhesive joints.; TECHNOLOGY & ENGINEERING / Mechanical; Electronic books.

In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --