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05484nam a2200709 4500 |
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ocn911618352 |
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OCoLC |
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20170124070347.4 |
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150623s2015 nju o 001 0 eng |
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|a 2015025126
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|a DLC
|b eng
|e rda
|c DLC
|d N$T
|d IDEBK
|d DG1
|d EBLCP
|d YDXCP
|d CDX
|d RECBK
|d COO
|d OCLCF
|d OCLCO
|d OCLCQ
|d NLE
|d DEBBG
|d KSU
|d CCO
|d GrThAP
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|a GBB628725
|2 bnb
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|a 916922176
|a 935676702
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|a 9781119162322 (pdf)
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|a 1119162327 (pdf)
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|a 9781119162339 (epub)
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|a 1119162335 (epub)
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|z 9781119162193 (cloth)
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|a 9781119162346
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|a 1119162343
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|a 111916219X
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|a 9781119162193
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|a GBVCP
|b 83642574X
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|a DEBBG
|b BV043397907
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|a (OCoLC)911618352
|z (OCoLC)916922176
|z (OCoLC)935676702
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|a 9781119162339
|b Wiley
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|a pcc
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|a TA455.A34
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|a TEC
|x 009000
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|a 620.1/99
|2 23
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|a MAIN
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|a Progress in adhesion and adhesives /
|c edited by K.L. Mittal.
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1 |
|a Hoboken, New Jersey :
|b John Wiley and Sons, Inc.,
|c [2015]
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| 300 |
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|a 1 online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b n
|2 rdamedia
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| 338 |
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|a online resource
|b nc
|2 rdacarrier
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| 500 |
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|a Includes index.
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| 588 |
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|a Description based on print version record and CIP data provided by publisher.
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|a Cover; Title Page; Copyright Page; Contents; Preface; 1 Adhesion of Condensed Bodies at Microscale: Variation with Movable Boundary Conditions; 1.1 Introduction; 1.2 Kinematics: Energy Variation with Movable Boundary Conditions; 1.3 Microbeam/plate Adhesion; 1.4 Droplet Adhesion to a Solid; 1.5 Elastica Model of CNT Adhesion; 1.6 Cell Adhesion; 1.7 Summary and Prospects; Acknowledgements; References; 2 Imparting Adhesion Property to Silicone Materials: Challenges and Solutions; 2.1 Introduction; 2.2 Cured PDMS; 2.2.1 Curing Reactions; 2.2.1.1 Free-Radical Curing; 2.2.1.2 Condensation Curing
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|a 2.2.1.3 Hydrosilylation (Addition) Curing2.2.2 Surface Properties; 2.2.3 Adhesion Property; 2.3 Methods for Cross-Linked PDMS Surface Modification; 2.3.1 Physical Techniques; 2.3.1.1 Plasma Treatment; 2.3.1.2 Corona Treatment; 2.3.1.3 UV/O3 Treatment; 2.3.1.4 Laser Treatment; 2.3.1.5 Physical Adsorption; 2.3.2 Wet Chemical Techniques; 2.3.2.1 LbL Deposition; 2.3.2.2 Sol-Gel Method; 2.3.2.3 Other Wet Chemical Treatments; 2.3.3 Combination of Physical and Chemical Techniques; 2.3.3.1 Covalent Surface Grafting; 2.3.3.2 Modification by Amphiphilic Block Copolymers
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|a 2.3.3.3 Other Combination of Physical and Chemical Techniques2.4 Summary and Prospects; Acknowledgements; References; 3 Functionally Graded Adhesively Bonded Joints; 3.1 Introduction; 3.2 Functionally Graded Materials; 3.3 Constitutive Relations; 3.4 Joints with Functionally Graded Adherends; 3.5 Functionally Graded Adhesives; 3.6 Conclusions; References; 4 Synthetic Adhesives for Wood Panels: Chemistry and Technology; 4.1 Introduction; 4.2 Urea-formaldehyde (UF) Adhesives; 4.3 Melamine-formaldehyde (MF) and Melamine-ureaformaldehyde (MUF) Adhesives; 4.4 Phenolic Resins
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|a 4.4.1 Reactivity and Hardening Reactions of PF Adhesive Resins4.4.2 Modification of Phenolic Resins; 4.4.2.1 Post-addition of Urea; 4.4.2.2 Co-condensation Between Phenol and Urea; 4.4.2.3 Addition of Tannins, Lignins and Isocyanates; 4.5 Isocyanate Wood Adhesives; 4.5.1 Chemistry of Isocyanate Wood Adhesives; 4.5.2 Technology of Isocyanate as Adhesives; 4.5.3 Emulsified/emulsifiable Water-dispersed PMDI; 4.5.4 PF/pMDI and UF/pMDI Hybrid Adhesives; 4.5.5 Conditions for Application of Isocyanate Adhesives for Wood; 4.6 Summary; References; 5 Adhesion Theories in Wood Adhesive Bonding
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|a 5.1 Introduction5.1.1 Wood Material Properties Relevant to Adhesion; 5.1.2 Objectives; 5.2 Mechanical Interlocking and Mechanics of Adhesive-Wood Interactions; 5.2.1 Atomic Force Microscopy (AFM) & Nanoindentation; 5.3 Electrostatic Adhesion; 5.4 Wettability, Surface Energy, Thermodynamic Adhesion; 5.4.1 Wood Anatomy Impact on Wetting; 5.4.2 Extractives; 5.4.3 Adhesive Wettability; 5.4.4 Wood Modification; 5.4.4.1 Acetylation; 5.4.4.2 Grafting; 5.4.4.3 Fire Retardants, Preservatives and Adhesion Promotion; 5.4.5 Test Methods; 5.5 Diffusion Theory of Adhesion; 5.6 Covalent Bonding
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|a Includes bibliographical references and index.
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|a Owing to Legal Deposit regulations this resource may only be accessed from within National Library of Scotland. For more information contact enquiries@nls.uk.
|5 StEdNL
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| 650 |
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0 |
|a Adhesives.
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| 650 |
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7 |
|a TECHNOLOGY & ENGINEERING / Engineering (General)
|2 bisacsh
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| 650 |
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7 |
|a TECHNOLOGY & ENGINEERING / Reference
|2 bisacsh
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| 650 |
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7 |
|a Adhesives.
|2 fast
|0 (OCoLC)fst00796614
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| 650 |
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4 |
|a Adhesion -- Research -- Congresses.
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| 650 |
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4 |
|a Adhesion -- Testing -- Congresses.
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| 650 |
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4 |
|a Adhesives -- Congresses.
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| 655 |
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4 |
|a Electronic books.
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| 655 |
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0 |
|a Electronic books.
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| 700 |
1 |
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|a Mittal, K. L.,
|d 1945-
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| 776 |
0 |
8 |
|i Print version:
|t Progress in adhesion and adhesives
|d Hoboken, New Jersey : John Wiley and Sons, Inc., [2015]
|z 9781119162193
|w (DLC) 2015023710
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| 856 |
4 |
0 |
|u https://doi.org/10.1002/9781119162346
|z Full Text via HEAL-Link
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| 994 |
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|a 92
|b DG1
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