Reactions and mechanisms in thermal analysis of advanced materials /

Strong bonds form stronger materials. For this reason, the investigation on thermal degradation of materials is a significantly important area in research and development activities. The analysis of thermal stability can be used to assess the behavior of materials in the aggressive environmental con...

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Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς: Tiwari, Atul (Επιμελητής έκδοσης), Raj, Baldev, 1947- (Επιμελητής έκδοσης)
Μορφή: Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Hoboken, New Jersey : Salem, Massachusetts : John Wiley & Sons ; Scrivener Publishing, 2015.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 03804nam a2200613 4500
001 ocn913890603
003 OCoLC
005 20170124072019.2
006 m o d
007 cr |||||||||||
008 150714s2015 nju ob 001 0 eng
010 |a  2015027731 
040 |a DLC  |b eng  |e rda  |c DLC  |d N$T  |d DG1  |d IDEBK  |d YDXCP  |d CDX  |d OCLCF  |d EBLCP  |d YDX  |d DEBBG  |d KSU  |d RECBK  |d CCO  |d GrThAP 
019 |a 957617180 
020 |a 9781119117698 (Adobe PDF) 
020 |a 1119117690 (Adobe PDF) 
020 |a 9781119117704 (ePub) 
020 |a 1119117704 (ePub) 
020 |z 9781119117575 (cloth) 
020 |a 9781119117711 
020 |a 1119117712 
029 1 |a ZWZ  |b 190116811 
029 1 |a GBVCP  |b 83576821X 
029 1 |a DEBBG  |b BV043397945 
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072 7 |a TEC  |x 035000  |2 bisacsh 
082 0 0 |a 620.1/1217  |2 23 
049 |a MAIN 
245 0 0 |a Reactions and mechanisms in thermal analysis of advanced materials /  |c edited by Atul Tiwari and Baldev Raj. 
264 1 |a Hoboken, New Jersey :  |b John Wiley & Sons ;  |a Salem, Massachusetts :  |b Scrivener Publishing,  |c 2015. 
300 |a 1 online resource. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
588 |a Description based on print version record and CIP data provided by publisher. 
520 |a Strong bonds form stronger materials. For this reason, the investigation on thermal degradation of materials is a significantly important area in research and development activities. The analysis of thermal stability can be used to assess the behavior of materials in the aggressive environmental conditions, which in turn provides valuable information about the service life span of the materiel. Unlike other books published so far that have focused on either the fundamentals of thermal analysis or the degradation pattern of the materials, this book is specifically on the mechanism of degradation of materials. The mechanism of rapturing of chemical bonds as a result of exposure to high-temperature environment is difficult to study and resulting mechanistic pathway hard to establish. Limited information is available on this subject in the published literatures and difficult to excavate. Chapters in this book are contributed by the experts working on thermal degradation and analysis of the wide variety of advanced and traditional materials. Each chapter discusses the material, its possible application, behavior of chemical entities when exposed to high-temperature environment and mode and the mechanistic route of its decomposition. Such information is crucial while selecting the chemical ingredients during the synthesis or development of new materials technology. 
650 0 |a Materials at high temperatures. 
650 0 |a Materials  |x Deterioration. 
650 0 |a Materials  |x Analysis. 
650 7 |a TECHNOLOGY & ENGINEERING / Engineering (General)  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING / Reference  |2 bisacsh 
650 7 |a Materials  |x Analysis.  |2 fast  |0 (OCoLC)fst01011773 
650 7 |a Materials at high temperatures.  |2 fast  |0 (OCoLC)fst01011904 
650 7 |a Materials  |x Deterioration.  |2 fast  |0 (OCoLC)fst01011800 
655 4 |a Electronic books. 
700 1 |a Tiwari, Atul,  |e editor. 
700 1 |a Raj, Baldev,  |d 1947-  |e editor. 
776 0 8 |i Print version:  |t Reactions and mechanisms in thermal analysis of advanced materials  |d Hoboken, New Jersey : John Wiley & Sons ; Salem, Massachusetts : Scrivener Publishing, 2015  |z 9781119117575  |w (DLC) 2015024897 
856 4 0 |u https://doi.org/10.1002/9781119117711  |z Full Text via HEAL-Link 
994 |a 92  |b DG1