Materials for Information Technology Devices, Interconnects and Packaging

• Main Author: Zschech, Ehrenfried
• Other Authors: Whelan, Caroline, Mikolajick, Thomas
• Format: Electronic Kit Book
• Language: English
• Published: London Springer-Verlag London Limited 2005
• Series: Engineering Materials and Processes
• Subjects: Engineering; Materials; Surfaces (Physics); Electronics; Particles (Nuclear physics); Μεταλλεύματα; Ceramics, Glass, Composites, Natural Methods; Surfaces and Interfaces, Thin Films; Electronics and Microelectronics, Instrumentation; Physics and Applied Physics in Engineering; Solid State Physics and Spectroscopy