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Bonding in Microsystem Technology

Bonding in Microsystem Technology

Bibliographic Details
Main Author: Dziuban, Jan A.
Format: Electronic Kit Book
Language:English
Published: Dordrecht Springer 2006
Series:Springer Series in Advanced Microelectronics 24
Subjects:
Engineering
Optical materials
Electronics
Materials
Structural control (Engineering)
Optical and Electronic Materials
Electronics and Microelectronics, Instrumentation
Physics and Applied Physics in Engineering
Continuum Mechanics and Mechanics of Materials
Βιομηχανική παραγωγικότητα
Online Access:http://dx.doi.org/10.1007/1-4020-4589-1
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http://dx.doi.org/10.1007/1-4020-4589-1

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