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LEADER |
01410nom a2200373 u 4500 |
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10073036 |
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upatras |
005 |
20210301110033.0 |
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090513s2006 eng |
020 |
|
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|a 9781402045899
|
040 |
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|a GR-PaULI
|c GR-PaULI
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041 |
0 |
|
|a eng
|
100 |
1 |
|
|a Dziuban, Jan A.
|9 71771
|
245 |
1 |
0 |
|a Bonding in Microsystem Technology
|h [electronic resource]
|c by Jan A. Dziuban
|
260 |
|
|
|a Dordrecht
|b Springer
|c 2006
|
300 |
|
|
|b v.: digital
|
490 |
0 |
|
|a Springer Series in Advanced Microelectronics
|v 24
|x 1437-0387
|
650 |
|
4 |
|a Engineering
|9 17712
|
650 |
|
4 |
|a Optical materials
|9 64444
|
650 |
|
4 |
|a Electronics
|9 15695
|
650 |
|
4 |
|a Materials
|9 13218
|
650 |
|
4 |
|a Structural control (Engineering)
|9 64858
|
650 |
|
4 |
|a Engineering
|9 17712
|
650 |
|
4 |
|a Optical and Electronic Materials
|9 64446
|
650 |
|
4 |
|a Electronics and Microelectronics, Instrumentation
|9 64430
|
650 |
|
4 |
|a Physics and Applied Physics in Engineering
|9 64483
|
650 |
|
4 |
|a Continuum Mechanics and Mechanics of Materials
|9 64481
|
650 |
|
4 |
|a Βιομηχανική παραγωγικότητα
|9 10497
|
760 |
1 |
|
|a Springer Series in Advanced Microelectronics
|g 24
|x 1437-0387
|
852 |
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|a GR-PaULI
|b ΠΑΤΡΑ
|b ΒΚΠ
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|u http://dx.doi.org/10.1007/1-4020-4589-1
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