Bonding in Microsystem Technology

Bonding in Microsystem Technology

Εμφάνιση άλλων εκδόσεων (1)

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Dziuban, Jan A.
Μορφή:	Ηλεκτρονική πηγή Εργαλειοθήκη Βιβλίο
Γλώσσα:	English
Έκδοση:	Dordrecht Springer 2006
Σειρά:	Springer Series in Advanced Microelectronics 24
Θέματα:	Engineering Optical materials Electronics Materials Structural control (Engineering) Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Physics and Applied Physics in Engineering Continuum Mechanics and Mechanics of Materials Βιομηχανική παραγωγικότητα
Διαθέσιμο Online:	http://dx.doi.org/10.1007/1-4020-4589-1

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