Bonding in Microsystem Technology

• Main Author: Dziuban, Jan A.
• Format: Electronic Kit Book
• Language: English
• Published: Dordrecht Springer 2006
• Series: Springer Series in Advanced Microelectronics 24
• Subjects: Engineering; Optical materials; Electronics; Materials; Structural control (Engineering); Optical and Electronic Materials; Electronics and Microelectronics, Instrumentation; Physics and Applied Physics in Engineering; Continuum Mechanics and Mechanics of Materials; Βιομηχανική παραγωγικότητα