RF and Microwave Microelectronics Packaging

• Main Author: Kuang, Ken
• Corporate Author: SpringerLink (Online service)
• Other Authors: Kim, Franklin, Cahill, Sean S.
• Format: Electronic Kit Book
• Language: English
• Published: Boston, MA Springer-Verlag US 2010
• Subjects: Engineering; Microwaves; Electronics; Systems engineering; Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems