Moisture Sensitivity of Plastic Packages of IC Devices
| Main Author: | |
|---|---|
| Corporate Author: | |
| Other Authors: | |
| Format: | Electronic Kit Book |
| Language: | English |
| Published: |
Boston, MA
Springer Science+Business Media, LLC
2010
|
| Series: | Micro- and Opto-Electronic Materials, Structures, and Systems
|
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1007/978-1-4419-5719-1 |
