Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures

• Main Author: Xie, Yuan
• Corporate Author: SpringerLink (Online service)
• Other Authors: Cong, Jason, Sapatnekar, Sachin
• Format: Electronic Kit Book
• Language: English
• Published: Boston, MA Springer-Verlag US 2010
• Series: Integrated Circuits and Systems
• Subjects: Engineering; Electronics; Optical materials; Surfaces (Physics); Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general