Microelectronics Packaging Handbook Subsystems Packaging

• Other Authors: Tummala, Rao R., 1942- (Editor), RYMASZEWSKI, EUGENE J. (Editor), KLOPFENSTEIN, ALAN G. (Editor)
• Format: Book
• Language: Greek
• Published: Boston Kluwer Academic Publishers 1997
• Edition: 2nd ed.
• Subjects: Μικροηλεκτρονική; HANDBOOK

Table of Contents:

• Table of Contents: Foreword, Preface, Conversion factors, Summary contents, PART 3:MICROELECTRONICS PACKAGING HANDBOOK: SUBSYSTEM PACKAGING, 15.Microelectronics packaging- an overview, 16.Package-to-board interconnections, 17.Printed-wiring board packaging, 18.Coated-metal packaging, 19.Connector and cable packaging, 20.Packaging of optoelectronics with electronics, Glossary and symbols, Authors' biographies, Index.