IC Interconnect Analysis

IC Interconnect Analysis

As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς:	Celik, Mustafa (Συγγραφέας), Pileggi, Lawrence (Συγγραφέας), Odabasioglu, Altan (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	English
Έκδοση:	Boston, MA : Springer US, 2002.
Θέματα:	Engineering. Computer-aided engineering. Electrical engineering. Electronic circuits. Circuits and Systems. Electrical Engineering. Computer-Aided Engineering (CAD, CAE) and Design.
Διαθέσιμο Online:	Full Text via HEAL-Link

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