IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...
Main Authors: | Celik, Mustafa (Author), Pileggi, Lawrence (Author), Odabasioglu, Altan (Author) |
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Corporate Author: | SpringerLink (Online service) |
Format: | Electronic eBook |
Language: | English |
Published: |
Boston, MA :
Springer US,
2002.
|
Subjects: | |
Online Access: | Full Text via HEAL-Link |
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