Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

• Main Authors: Laconte, J. (Author), Flandre, D. (Author), Raskin, J. -P (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2006.
• Subjects: Engineering.; Mechanics.; Solid state physics.; Industrial engineering.; Production engineering.; Electronics.; Microelectronics.; Electronic circuits.; Engineering, general.; Industrial and Production Engineering.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Solid State Physics.

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integ...