MEMS Materials and Processes Handbook

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Ghodssi, Reza (Επιμελητής έκδοσης), Lin, Pinyen (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2011.
• Σειρά: MEMS Reference Shelf, 1
• Θέματα: Engineering.; Electronics.; Microelectronics.; Electronic circuits.; Materials science.; Materials > Surfaces.; Thin films.; Electronics and Microelectronics, Instrumentation.; Materials Science, general.; Circuits and Systems.; Surfaces and Interfaces, Thin Films.

MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The...

Πίνακας περιεχομένων:

• Introduction – Reza Ghodssi and Pinyen Lin
• The MEMS Design Process – Tina Lamers and Beth Pruitt
• Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman, Robert C. Roberts and Li Chen
• Additive Processes for Metals – David Arnold, Monika Saumer and Yong Kyu-Yoon
• Additive Processes for Polymeric Materials – Ellis Meng, Xin Zhang, and William Benard
• Additive Processes for Piezoelectric Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga
• Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga
• Dry Etching for Micromachining Applications – Srinivas Tadigadapa and Franz Laermer
• MEMS Wet-Etch Processes and Procedures – David Burns
• MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi
• Doping - Alan D. Raisanen
• Wafer Bonding – Shawn Cunningham and Mario Kupnik
• MEMS Packaging Materials – Ann Garrison Darrin and Robert Osiander
• Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan
• MEMS Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin.              .