Wafer Level 3-D ICs Process Technology

• Corporate Author: SpringerLink (Online service)
• Other Authors: Tan, Chuan Seng (Editor), Gutmann, Ronald J. (Editor), Reif, L. Rafael (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2008.
• Series: Integrated Circuits and Systems,
• Subjects: Engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Materials > Surfaces.; Thin films.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Surfaces and Interfaces, Thin Films.; Engineering, general.

Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for impro...