APA (7th ed.) Citation

SpringerLink (Online service), Tan, C. S., Gutmann, R. J., & Reif, L. R. (2008). Wafer Level 3-D ICs Process Technology. Springer US.

Chicago Style (17th ed.) Citation

SpringerLink (Online service), Chuan Seng Tan, Ronald J. Gutmann, and L. Rafael Reif. Wafer Level 3-D ICs Process Technology. Boston, MA: Springer US, 2008.

MLA (8th ed.) Citation

SpringerLink (Online service), et al. Wafer Level 3-D ICs Process Technology. Springer US, 2008.