Materials for Advanced Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Lu, Daniel (Editor), Wong, C.P (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2009.
• Subjects: Materials science.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Nanotechnology.; Metals.; Materials Science.; Optical and Electronic Materials.; Metallic Materials.; Electronics and Microelectronics, Instrumentation.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging tech...