Materials for Advanced Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lu, Daniel (Επιμελητής έκδοσης), Wong, C.P (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2009.
• Θέματα: Materials science.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Nanotechnology.; Metals.; Materials Science.; Optical and Electronic Materials.; Metallic Materials.; Electronics and Microelectronics, Instrumentation.

 Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering. 

 3D Integration Technologies – An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Production -- Advanced Substrates: A Materials and Processing Perspective -- Advanced Print Circuit Board Materials -- Flip-Chip Underfill: Materials, Process and Reliability -- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Nanomaterials and Nanopackaging -- Wafer Level Chip Scale Packaging -- Microelectromechanical Systems and Packaging -- LED and Optical Device Packaging and Materials -- Digital Health and Bio-Medical Packaging.