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03057nam a22005655i 4500 |
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978-1-4020-4589-9 |
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DE-He213 |
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20151204140651.0 |
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cr nn 008mamaa |
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100301s2006 ne | s |||| 0|eng d |
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|a 9781402045899
|9 978-1-4020-4589-9
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|a 10.1007/1-4020-4589-1
|2 doi
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|a 620.1
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|a Dziuban, Jan A.
|e author.
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|a Bonding in Microsystem Technology
|h [electronic resource] /
|c by Jan A. Dziuban.
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|a Dordrecht :
|b Springer Netherlands,
|c 2006.
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| 300 |
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|a XVIII, 334 p.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a text file
|b PDF
|2 rda
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|a Springer Series in Advanced Microelectronics,
|x 1437-0387 ;
|v 24
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|a Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks.
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| 520 |
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|a Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
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|a Engineering.
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|a Continuum mechanics.
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|a Industrial engineering.
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|a Electronics.
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| 650 |
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|a Microelectronics.
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| 650 |
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|a Optical materials.
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| 650 |
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|a Electronic materials.
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| 650 |
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|a Engineering.
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| 650 |
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|a Continuum Mechanics and Mechanics of Materials.
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| 650 |
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|a Engineering, general.
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| 650 |
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|a Optical and Electronic Materials.
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| 650 |
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|a Electronics and Microelectronics, Instrumentation.
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| 650 |
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|a Operating Procedures, Materials Treatment.
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| 710 |
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|a SpringerLink (Online service)
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|t Springer eBooks
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| 776 |
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|i Printed edition:
|z 9781402045783
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| 830 |
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|a Springer Series in Advanced Microelectronics,
|x 1437-0387 ;
|v 24
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| 856 |
4 |
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|u http://dx.doi.org/10.1007/1-4020-4589-1
|z Full Text via HEAL-Link
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| 912 |
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|a ZDB-2-ENG
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| 950 |
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|a Engineering (Springer-11647)
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