Bonding in Microsystem Technology

• Κύριος συγγραφέας: Dziuban, Jan A. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands, 2006.
• Σειρά: Springer Series in Advanced Microelectronics, 24
• Θέματα: Engineering.; Continuum mechanics.; Industrial engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Continuum Mechanics and Mechanics of Materials.; Engineering, general.; Optical and Electronic Materials.; Electronics and Microelectronics, Instrumentation.; Operating Procedures, Materials Treatment.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...

Πίνακας περιεχομένων:

• Some Remarks on Microsystem Systematics and Development
• Deep, Three-Dimensional Silicon Micromachining
• Bonding
• Classification of Bonding and Closing Remarks.