Bonding in Microsystem Technology

• Main Author: Dziuban, Jan A. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Dordrecht : Springer Netherlands, 2006.
• Series: Springer Series in Advanced Microelectronics, 24
• Subjects: Engineering.; Continuum mechanics.; Industrial engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Continuum Mechanics and Mechanics of Materials.; Engineering, general.; Optical and Electronic Materials.; Electronics and Microelectronics, Instrumentation.; Operating Procedures, Materials Treatment.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...

Table of Contents:

• Some Remarks on Microsystem Systematics and Development
• Deep, Three-Dimensional Silicon Micromachining
• Bonding
• Classification of Bonding and Closing Remarks.