Three Dimensional System Integration IC Stacking Process and Design /

Three Dimensional System Integration IC Stacking Process and Design /

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Άλλοι συγγραφείς:	Papanikolaou, Antonis (Επιμελητής έκδοσης), Soudris, Dimitrios (Επιμελητής έκδοσης), Radojcic, Riko (Επιμελητής έκδοσης)
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	English
Έκδοση:	Boston, MA : Springer US, 2011.
Θέματα:	Architecture. Construction. Electronic circuits. Architecture / Design. Basics of Construction. Circuits and Systems.
Διαθέσιμο Online:	Full Text via HEAL-Link

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