Three Dimensional System Integration IC Stacking Process and Design /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Papanikolaou, Antonis (Editor), Soudris, Dimitrios (Editor), Radojcic, Riko (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2011.
• Subjects: Architecture.; Construction.; Electronic circuits.; Architecture / Design.; Basics of Construction.; Circuits and Systems.

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, de...

Table of Contents:

• The next step in system integration: the benefits of going 3-D
• Process technology for manufacturing Through-Silicon Vias (TSVs)
• Alternative 3D integration schemes
• Manufacturing issues in 3D stacked ICs
• TSV characterization
• Physical design of 3D stacked ICs
• DRAM on logic stacking
• 3D general purpose micro-processors
• 3D system design: a holistic design approach.