RF and Microwave Microelectronics Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kuang, Ken (Editor), Kim, Franklin (Editor), Cahill, Sean S. (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2010.
• Subjects: Engineering.; Microwaves.; Optical engineering.; Electronics.; Microelectronics.; Electronic circuits.; Electronics and Microelectronics, Instrumentation.; Microwaves, RF and Optical Engineering.; Circuits and Systems.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...