RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Συγγραφή απο Οργανισμό/Αρχή: | |
---|---|
Άλλοι συγγραφείς: | , , |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Boston, MA :
Springer US,
2010.
|
Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
- Polymeric Microelectromechanical Millimeter Wave Systems
- Millimeter-Wave Chip-on-Board Integration and Packaging
- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
- RF/Microwave Substrate Packaging Roadmap for Portable Devices
- Ceramic Systems in Package for RF and Microwave
- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
- LTCC Substrates for RF/MW Application
- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
- High Performance Microelectronics Packaging Heat Sink Materials
- Technology Research on AlN 3D MCM.