Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

• Κύριος συγγραφέας: Lim, Sung Kyu (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York : Imprint: Springer, 2013.
• Θέματα: Engineering.; Microprocessors.; Nanotechnology.; Electronic circuits.; Circuits and Systems.; Nanotechnology and Microengineering.; Processor Architectures.

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...