Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

• Main Author: Lim, Sung Kyu (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2013.
• Subjects: Engineering.; Microprocessors.; Nanotechnology.; Electronic circuits.; Circuits and Systems.; Nanotechnology and Microengineering.; Processor Architectures.

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...