Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...
Κύριος συγγραφέας: | Lim, Sung Kyu (Συγγραφέας) |
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Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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